LINGSEN PRECISION INDUSTRIES, LTD.
菱生精密工業股份有限公司
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1973Founded
NT$3.8BPaid-in capital
5Plants
2Certifications
4Patents
≥ NT$5BRevenue band
- Unified Business No.
- 55625676
- Industry
- Electronic Components (2,523)
- Main products
- Semiconductors (243)
- Location
- No. 5-1, S. 2nd Rd., Tanzi Dist., Taichung City 42760, Taiwan (R.O.C.)
Taichung City (17,121) · Tanzi Dist. (847) - Listing
- Listed (TWSE) (1,087) 2369
- Registration status
- Approved / Active
- Organisation type
- Company Limited by Shares
- Founded
- 1973-04-23
- Paid-in capital
- NT$ 3,801,023,440
- Representative
- Yeh Shu-chuan
- Phone
- 04-25335120
- Website
- https://www.lingsen.com.tw/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- ≥ NT$5B
- Ownership
- Family-run (inferred)
- Representative tenure
- In office since at least 2013 (13+ years)
- Growth & profitability
- Revenue 2026-09 YoY +23.9%, year-to-date +34.8%
Gross margin 8.8%, operating margin 3.2%, net margin 3.1% (2026-Q2 YTD) - Compliance record
- Environmental penalties: 1 case(s) in 5 years, latest 2026-03-11, fines NT$ 100,000 (stationary air pollution)
Plants 5
- Plant 1 · No. 5-1, 5-2, 5-2-1, 5-3, 5-4, Nan'er Rd., Tanzi Dist., Taichung City In production
- Zhonggang Plant · No. 37, Daguan Rd., Wuqi Dist., Taichung City In production
- Plant 2 · No. 36, 36-1, 36-2, 36-3, 38, 38-1, 38-2, 38-3, 40, 40-1, 40-2, 40-3, 42-1, 42-2, 42-3, Nan'er Rd., Tanzi Dist., Taichung City In production
- Plant 5 · No. 22, 22-1, 22-2, Nan'er Rd., Tanzi Dist., Taichung City In production
- Plant 4 · No. 4, 4-1, 4-2, 6, 6-1, 6-2, 8-1, 8-2, 10-1, 10-2, Nan'er Rd., Tanzi Dist., Taichung City In production
Certifications 2
- IATF 16949 (433)Self-reported
- ISO 9001 (4,293)Self-reported
Processes & materials 6
- Semiconductor Packaging (3) · Extracted from websiteSelf-reported
- MEMS packaging (1) · Extracted from websiteSelf-reported
- Optoelectronic packaging (1) · Extracted from websiteSelf-reported
- Discrete component packaging (1) · Extracted from websiteSelf-reported
- Quad flat package (QFP) (1) · Extracted from websiteSelf-reported
- Dual in-line package (DIP) (1) · Extracted from websiteSelf-reported
Patents 4
- 2025 Chip package structure and manufacturing method for air chamber protecting chip functional area
- 2024 Preformed unit for fan-out chip embedded packaging process and application method thereof
- 2022 AI defect image classification method and system thereof
Recent changes 1
- PenaltiesEnvironmental penalties: latest case 2026-03-11; 1 case(s) in 5 years, fines NT$ 100,000
RSS feed · Recent changes at Taiwanese manufacturers →
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