FORMOSA ADVANCED TECHNOLOGIES CO., LTD.
福懋科技股份有限公司
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1990Founded
NT$4.4BPaid-in capital
1Plants
9Certifications
41Patents
≥ NT$5BRevenue band
- Unified Business No.
- 23826736
- Industry
- Electronic Components (2,523)
- Main products
- Semiconductors (243)
- Location
- NO. 329, HENAN ST., LIUZHONG VIL., DOULIU CITY, YUNLIN COUNTY 640, TAIWAN (R.O.C.)
Yunlin County (2,133) · Douliu City (418) - Listing
- Listed (TWSE) (1,087) 8131
- Organisation type
- Company Limited by Shares
- Founded
- 1990-09-11
- Paid-in capital
- NT$ 4,422,222,230
- Representative
- Chang Hsien-cheng
- Phone
- 05-5574888
- Website
- https://www.fatc.com.tw/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- ≥ NT$5B
- Ownership
- Group subsidiary / corporate-held · NANYA TECHNOLOGY CORPORATION、FORMOSA TAFFETA CO., LTD.
- Representative tenure
- In office since 2025-08 (1 yrs); last handover 2025-08
- Growth & profitability
- Revenue 2026-09 YoY +35.5%, year-to-date +37.2%
Gross margin 19.6%, operating margin 15.7%, net margin 14% (2026-Q2 YTD) - Compliance record
- Environmental penalties: 1 case(s) in 5 years, latest 2025-04-28, fines NT$ 6,000 (industrial waste)
Labour Standards Act penalties: 1 case(s) in 5 years, latest 2023-08-25, fines NT$ 50,000 (Art. 39) — matched by company name
Occupational safety penalties: 1 case(s) in 5 years, latest 2021-10-20 (Art. 58) — matched by company name
Certifications 9
- ISO 50001 (296)Official registry · SGS Taiwan Ltd.
- IATF 16949 (433)Self-reported
- ISO 14001 (1,159)Self-reported
- ISO 27001 (292)Self-reported
- ISO 45001 (962)Self-reported
- ISO 50001 (296)Self-reported
- ISO 9001 (4,293)Self-reported
- QC 080000 (164)Self-reported
- RoHS (350)Self-reported
Processes & materials 1
- Casting (638) · FormingSelf-reported
Patents 41
- 2025 Assembly jig and assembly method
- 2025 Lead frame clamping mechanism
- 2025 Heating jig of wire bonding machine
Similar companies 10
- ZOWIE TECHNOLOGY CORP. · New Taipei City NT$1–5B estimated
Shared: IATF 16949, RoHS, Semiconductor packaging & testing - SYNC-TECH SYSTEM CORP. · Hsinchu County Emerging stock (TPEx) NT$1–5B
Shared: Other electronic components manufacturing n.e.c., Semiconductor packaging & testing - TESCORE CO., LTD. · Hsinchu County < NT$20M estimated
Shared: Other electronic components manufacturing n.e.c., Semiconductor packaging & testing - RAMSUN SYSTEM TESTING INC. · Hsinchu County NT$20–100M estimated
Shared: Semiconductor packaging & testing - LOMITES CO., LTD · Hsinchu County < NT$20M estimated
Shared: Semiconductor packaging & testing - VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION · Hsinchu City Listed (TPEx) ≥ NT$5B
Shared: Casting, Semiconductor packaging & testing - POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION · Hsinchu City Listed (TWSE) ≥ NT$5B
Shared: Casting, IATF 16949, RoHS - CHIPBOND TECHNOLOGY CORPORATION · Hsinchu City Listed (TPEx) ≥ NT$5B
Shared: Casting, IATF 16949, Semiconductor packaging & testing - Yao Cheng Electronic Technology Co., Ltd. · Taoyuan City NT$20–100M estimated
Shared: Other printed circuit board assembly manufacturing n.e.c., Other electronic components manufacturing n.e.c., Semiconductor packaging & testing - PRINCETON TECHNOLOGY CORP. · New Taipei City Listed (TPEx) NT$1–5B
Shared: Casting, RoHS