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CHIPBOND TECHNOLOGY CORPORATION

頎邦科技股份有限公司

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1997Founded
NT$7.4BPaid-in capital
6Plants
10Certifications
113Patents
≥ NT$5BRevenue band
Unified Business No.
16130009
Industry
Electronic Components (2,523)
Main products
Semiconductors (243)
Location
NO.3, LIHSIN 5 RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN, R.O.C.
Hsinchu City (1,019) · East Dist. (401)
Listing
Listed (TPEx) (890) 6147
Registration status
Approved / Active
Organisation type
Company Limited by Shares
Founded
1997-07-02
Paid-in capital
NT$ 7,445,775,390
Representative
Shih Cheng-hung
Phone
(03)567-8788
Website
https://www.chipbond.com.tw/zh-TW
Exporter
Yes — registered with the Trade Administration
Annual revenue band
≥ NT$5B
Ownership
Individually held
Representative tenure
In office since at least 2013 (13+ years)
Growth & profitability
Revenue 2026-09 YoY +27.9%, year-to-date +24.3%
Gross margin 27.1%, operating margin 16.7%, net margin 11.2% (2026-Q2 YTD)
Compliance record
Environmental penalties: 5 case(s) in 5 years, latest 2024-12-20, fines NT$ 563,500 (industrial waste; stationary air pollution; water pollution)
Gender Equality in Employment Act penalties: 1 case(s) in 5 years, latest 2022-09-15 (Art. 13) — matched by company name
Labour Standards Act penalties: 6 case(s) in 5 years, latest 2026-08-19, fines NT$ 400,000 (Art. 32; Art. 36; Art. 39) — matched by company name

Plants 6

Certifications 10

Processes & materials 4

Patents 113

  • 2026 Semiconductor heat dissipation package structure
  • 2026 Etching endpoint determination method
  • 2026 Circuit board

Recent changes 1

  • PenaltiesLabour Standards Act penalties: latest case 2026-08-19; 6 case(s) in 5 years, fines NT$ 400,000

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