TONG HSING ELECTRONIC INDUSTRIES, LTD.
同欣電子工業股份有限公司
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1974Founded
NT$2.1BPaid-in capital
4Plants
9Certifications
126Patents
≥ NT$5BRevenue band
- Unified Business No.
- 04226986
- Industry
- Electronic Components (2,523)
- Main products
- Semiconductors (243)
- Location
- 6 F., NO. 83, YANPING S. RD., ZHONGZHENG DIST., TAIPEI CITY 10043, TAIWAN, R.O.C.
New Taipei City (16,829) · Yingge Dist. (571) - Listing
- Listed (TWSE) (1,087) 6271
- Registration status
- Approved / Active
- Organisation type
- Company Limited by Shares
- Founded
- 1974-08-11
- Paid-in capital
- NT$ 2,090,580,240
- Representative
- Chiu Szu-chi
- Phone
- 03-3625000
- Website
- https://www.theil.com/zh-tw
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- ≥ NT$5B
- Ownership
- Group subsidiary / corporate-held · Sheng Tai Hsing Enterprise Co., Ltd.、Huan Tai Co., Ltd.、Chang Hsin Tou Tzu Co., Ltd.、Shih Heng Industrial Co., Ltd.
- Representative tenure
- In office since 2019-07 (7 yrs); last handover 2019-07
- Growth & profitability
- Revenue 2026-09 YoY +22.1%, year-to-date +8.5%
Gross margin 29.6%, operating margin 16.2%, net margin 15.3% (2026-Q2 YTD) - Compliance record
- Environmental penalties: 1 case(s) in 5 years, latest 2026-06-26, fines NT$ 100,000 (stationary air pollution)
Labour Standards Act penalties: 6 case(s) in 5 years, latest 2026-06-11, fines NT$ 408,000 (Art. 22; Art. 32; Art. 24) — matched by company name
Occupational safety penalties: 1 case(s) in 5 years, latest 2021-11-05 (Art. 95) — matched by company name
Plants 4
- Taipei Gong Plant · No. 55, Ln. 365, Yingtao Rd., Yingge Dist., New Taipei City In production
- Zhubei Gong Plant · No. 84, Taihe Rd., Zhubei City, Hsinchu County In production
- Badegong Plant · No. 88, Ln. 1125, Heping Rd., Bade Dist., Taoyuan City In production
- Fengongsi Fengong · No. 21, Longyuan 5th Rd. (Hsinchu Science Park), Longtan Dist., Taoyuan City In production
Certifications 9
- AS9100 (85)Self-reported
- GMP (261)Self-reported
- IATF 16949 (433)Self-reported
- ISO 13485 (310)Self-reported
- ISO 14001 (1,159)Self-reported
- ISO 14064 (319)Self-reported
- ISO 27001 (292)Self-reported
- ISO 45001 (962)Self-reported
- ISO 9001 (4,293)Self-reported
Processes & materials 3
- Ceramics (438) · InorganicSelf-reported
- Grinding (430) · MachiningSelf-reported
- Powder metallurgy (190) · FormingSelf-reported
Patents 126
- 2026 Cavity-free sensing package structure and manufacturing method thereof
- 2026 Semiconductor package structure
- 2026 Composite ceramic substrate and manufacturing method thereof
Recent changes 2
- PenaltiesEnvironmental penalties: latest case 2026-06-26; 1 case(s) in 5 years, fines NT$ 100,000
- PenaltiesLabour Standards Act penalties: latest case 2026-06-11; 6 case(s) in 5 years, fines NT$ 408,000
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