PROSPERITY DIELECTRICS CO., LTD.
信昌電子陶瓷股份有限公司
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1990Founded
NT$1.7BPaid-in capital
2Plants
6Certifications
6Patents
≥ NT$5BRevenue band
- Unified Business No.
- 23641338
- Industry
- Electronic Components (2,523)
- Main products
- Passive electronic components (255)
- Location
- No. 566-1, Gaoshi Rd., Yangmei Dist., Taoyuan City 32668, Taiwan (R.O.C.)
Taoyuan City (10,976) · Yangmei Dist. (1,005) - Listing
- Listed (TPEx) (890) 6173
- Registration status
- Approved / Active
- Organisation type
- Company Limited by Shares
- Founded
- 1990-05-21
- Paid-in capital
- NT$ 1,712,000,000
- Representative
- Chiao Yu-heng
- Phone
- (03)475-3355
- Website
- http://www.pdc.com.tw/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- ≥ NT$5B
- Ownership
- Group subsidiary / corporate-held · WALSIN TECHNOLOGY CORP.、Ao Li Wei Co., Ltd.
- Representative tenure
- In office since at least 2013 (13+ years)
- Growth & profitability
- Revenue 2026-09 YoY +54.8%, year-to-date +29.3%
Gross margin 28.6%, operating margin 21.4%, net margin 21.4% (2026-Q2 YTD) - Compliance record
- Environmental penalties: 7 case(s) in 5 years, latest 2026-06-25, fines NT$ 854,500 (water pollution; stationary air pollution; toxic chemicals)
Labour Standards Act penalties: 8 case(s) in 5 years, latest 2024-10-07, fines NT$ 920,000 (Art. 32; Art. 36; Art. 38) — matched by company name
Occupational safety penalties: 3 case(s) in 5 years, latest 2025-09-04, fines NT$ 510,000 (Art. 287; Art. 230; Art. 29) — matched by company name
Plants 2
- Taoyuan Plant · No. 220-1, Sec. 2, Nanshan Rd., Luzhu Dist., Taoyuan City In production
- Yangmei Plant · 4F, 1F, No. 566-1, Gaoshi Rd., Yangmei Dist., Taoyuan City In production
Certifications 6
- ISO 45001 (962)Official registry Valid until 2028-10-03 · SGS Taiwan Ltd.
- AS9100 (85)Self-reported
- ISO 14001 (1,159)Self-reported
- ISO 9001 (4,293)Self-reported
- OHSAS 18001 (157)Self-reported
- QC 080000 (164)Self-reported
Processes & materials 2
- Ceramics (438) · InorganicThird-party audited
- Extrusion (323) · FormingSelf-reported
Patents 6
- 2026 Jig structure for reflow process of electronic component
- 2025 Reinforced bonding method for substrate layer and resistive layer of chip resistor
- 2021 Reinforced bonding structure for substrate layer and resistive layer of chip resistor
Recent changes 1
- PenaltiesEnvironmental penalties: latest case 2026-06-25; 7 case(s) in 5 years, fines NT$ 854,500
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