CAREER TECHNOLOGY MFG. CO., LTD.
嘉聯益科技股份有限公司
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1992Founded
NT$6.4BPaid-in capital
1Plants
2Certifications
33Patents
≥ NT$5BRevenue band
- Unified Business No.
- 86980046
- Industry
- Electronic Components (2,523)
- Main products
- Printed circuit boards (317)
- Location
- NO.248, BO-AI ST., SHULIN DIST., NEW TAIPEI CITY 238, TAIWAN, R.O.C.
New Taipei City (16,829) · Shulin Dist. (2,929) - Listing
- Listed (TWSE) (1,087) 6153
- Organisation type
- Company Limited by Shares
- Founded
- 1992-11-03
- Paid-in capital
- NT$ 6,361,776,940
- Representative
- Lee Chun-hsien
- Phone
- 02-86868868
- Website
- https://www.careergroups.com/ZH/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- ≥ NT$5B
- Ownership
- Group subsidiary / corporate-held · HANNSTAR BOARD CORPORATION
- Representative tenure
- In office since 2023-07 (3 yrs); last handover 2023-07
- Growth & profitability
- Revenue 2026-09 YoY +0.8%, year-to-date +4.7%
Gross margin -4.9%, operating margin -24.2%, net margin -20.1% (2026-Q2 YTD) - Compliance record
- Labour Standards Act penalties: 11 case(s) in 5 years, latest 2026-08-13, fines NT$ 832,000 (Art. 36; Art. 32; Art. 38) — matched by company name
Occupational safety penalties: 1 case(s) in 5 years, latest 2023-07-18, fines NT$ 100,000 (Art. 58) — matched by company name
Certifications 2
- ISO 14001 (1,159)Official registry Valid until 2026-10-09 · TÜV NORD Taiwan Ltd.
- ISO 14064 (319)Self-reported
Processes & materials 2
- Assembly (901) · Assembly & inspectionThird-party audited
- Welding (626) · JoiningSelf-reported
Patents 33
- 2025 Dynamically bendable vapor chamber substrate structure
- 2025 Multilayer board structure
- 2024 Manufacturing method for circuit board wiring structure with via hole and circuit board wiring structure with via hole manufactured thereby
Recent changes 2
- Certification expiryISO 14001 certificate expired on 2026-10-09
- PenaltiesLabour Standards Act penalties: latest case 2026-08-13; 11 case(s) in 5 years, fines NT$ 832,000
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