RORZE TECHNOLOGY INCORPORATED
樂華科技股份有限公司
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1996Founded
NT$160MPaid-in capital
2Plants
48Patents
NT$20–100MRevenue band (est.)
- Unified Business No.
- 84149596
- Industry
- Electronic Components (2,523)
- Main products
- Other electronic components (1,245)
- Location
- 1F., NO. 30, GONGYE E. 9TH RD., HSINCHU SCIENCE PARK, HSINCHU CITY 300, TAIWAN
Hsinchu City (1,019) · East Dist. (401) - Listing
- Not publicly issued (84,625)
- Registration status
- Approved / Active
- Organisation type
- Company Limited by Shares
- Founded
- 1996-03-04
- Paid-in capital
- NT$ 160,000,000
- Representative
- Lin Yung-kuo
- Phone
- 03-5776482
- Website
- https://www.rorze.com.tw/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- NT$20–100M estimated
- Ownership
- Foreign-owned · Japan · Le Hua Co., Ltd. (Japan)
- Representative tenure
- In office since 2017-05 (9 yrs); last handover 2017-05
Plants 2
- Plant 1 · 1F, No. 12, Gongye E. 4th Rd. (Hsinchu Science Park), East Dist., Hsinchu City In production
- Plant 2 · 1F, No. 30, Gongye E. 9th Rd. (Hsinchu Science Park), Baoshan Township, Hsinchu County In production
Processes & materials 8
- Semiconductor Wafer Automation (1) · Extracted from websiteSelf-reported
- Wafer/LCD Substrate Conveying Equipment Manufacturing (1) · Extracted from websiteSelf-reported
- Wafer Sorter / EFEM (1) · Extracted from websiteSelf-reported
- Wafer Transfer Arm Robot (1) · Extracted from websiteSelf-reported
- Wafer Storage System (1) · Extracted from websiteSelf-reported
- Wafer Aligner (1) · Extracted from websiteSelf-reported
- Wafer Inspection System (1) · Extracted from websiteSelf-reported
- FOUP Load Port (1) · Extracted from websiteSelf-reported
Patents 48
- 2026 Clamping device for semiconductor
- 2026 State detection device for chip substrate
- 2026 Rear door opening device for semiconductor container