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Patent：2026 Resin composition, cured layer, manufacturing method for cured layer and etching methodPatent：2025 Method of using connectable glue bucket for semiconductor processPatent：2025 Release agent composition and method for stripping photoresistCertification：CNS 45001（Laosheng (UK) Co., Ltd. Taiwan Branch）Certification：ISO 45001（Laosheng (UK) Co., Ltd. Taiwan Branch）Company website：https://www.aemc.com.tw/Phone：03-4072100Main product：Other chemical products n.e.c.

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