SFI ELECTRONICS TECHNOLOGY INC.
立昌先進科技股份有限公司
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2000Founded
NT$457MPaid-in capital
2Plants
6Certifications
3Patents
NT$0.5–1BRevenue band (est.)
- Unified Business No.
- 70475866
- Industry
- Electronic Components (2,523)
- Main products
- Passive electronic components (255)
- Location
- No. 6, Ln. 340, Shanying Rd., Guishan Dist., Taoyuan City 333017, Taiwan (R.O.C.)
Taoyuan City (10,976) · Guishan Dist. (1,601) - Listing
- Not publicly issued (84,625)
- Registration status
- Approved / Active
- Organisation type
- Company Limited by Shares
- Founded
- 2000-01-31
- Paid-in capital
- NT$ 457,000,000
- Representative
- Lien Ching-hung
- Phone
- 03-3492226
- Website
- https://sfi.com.tw
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- NT$0.5–1B estimated
- Ownership
- Group subsidiary / corporate-held · TAI-TECH ADVANCED ELECTRONICS CO., LTD.
- Representative tenure
- In office since 2026-07 (0 yrs); last handover 2026-07
Plants 2
- Guishan Plant 2 · No. 1, Ln. 340, Shanying Rd., Guishan Dist., Taoyuan City In production
- Guishan Plant · No. 6, Ln. 340, Shanying Rd., Guishan Dist., Taoyuan City In production
Certifications 6
- IATF 16949 (433)Self-reported
- ISO 14001 (1,159)Self-reported
- ISO 14064 (319)Self-reported
- ISO 9001 (4,293)Self-reported
- ISO/TS 16949 (104)Self-reported
- REACH (246)Self-reported
Processes & materials 10
- Automotive Electronics Protection (1) · Extracted from websiteSelf-reported
- ESD Protection (1) · Extracted from websiteSelf-reported
- Zinc Oxide (ZnO) Ceramic Material (1) · Extracted from websiteSelf-reported
- Ceramics (438) · InorganicSelf-reported
- Low-Temperature Sintering (1) · Extracted from websiteSelf-reported
- Powder metallurgy (190) · FormingSelf-reported
- Dual Doping Technology (1) · Extracted from websiteSelf-reported
- SGD Overvoltage Protection Device (1) · Extracted from websiteSelf-reported
- Chip Surge Protection Device (CSPD) (1) · Extracted from websiteSelf-reported
- Zinc Oxide Varistor (MLV) (1) · Extracted from websiteSelf-reported
Patents 3
- 2022 Electrostatic suppressor and manufacturing method thereof
- 2022 Electronic component package structure and manufacturing method thereof
- 2021 Packaging method for chip-type single small-size and array-type semiconductor device
Recent changes 1
- RepresentativeRepresentative handover — now Lien Ching-hung
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