Update your company profile

AG MATERIALS TECHNOLOGY CO.,LTD. 50838067

Add your products, processes, certifications and contacts. Published after review.

Contact details (shown on your company page for buyers)

Contact nameJob title

PhoneExt.

Contact email

Company website

Company information

English company nameCurrently: AG MATERIALS TECHNOLOGY CO.,LTD.Employees

Company address

Main products (one per line)

Processes

Machining

CNC machiningMould design & manufacturingTurningMillingGrindingPrecision machiningTappingEDMMachining centreEtchingLaser cuttingLaser EngravingWaterjet cutting

Forming

CastingStampingInjection MoldingExtrusionForgingDie castingBendingPunchingPowder metallurgyBlow mouldingInvestment castingWire & tube drawingSand castingRolling & roll forming

Surface treatment

Surface treatmentElectroplatingHeat treatmentPolishingCoating & paintingGalvanisingSand blastingQuenching & annealingAnodisingNitriding & carburisingPrecision cleaning

Joining

WeldingSpot weldingLaser weldingRiveting

Assembly & inspection

Testing & inspectionAssemblyCleanroom productionSMTCMM measurementPCBA

Other (comma-separated)

Materials

Metal

Stainless steelAluminium alloyCopper alloyCarbon steelTitanium alloyMagnesium alloy

Polymer

Rubber & siliconePolyesterComposite materialsNylonEngineering plastics

Inorganic

Ceramics

Other (comma-separated)

Applications (e.g. automotive, medical; comma-separated)

Main export markets

North AmericaEuropeJapanSouth KoreaMainland ChinaSoutheast AsiaIndiaMiddle EastLatin AmericaOceaniaAfrica

Other (comma-separated)

Certifications

Something wrong?

Tick anything that should be removed or is wrong

Patent：2026 Die bonding structure and method of forming samePatent：2025 Wafer processing system and wafer processing methodPatent：2025 Package structurePhone：04-25611950Main product：Semiconductors

Anything else to correct (optional)

About you (not published — used only to verify the submission)

Your name*Your job title

Your work email*A company-domain address is preferred. Not published.

About & data sources

TWDB Contact