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Patent：2026 Substrate structure with through-silicon via and manufacturing method thereofPatent：2025 Substrate structure with through-silicon viaPatent：2025 Wafer protection structure in wafer bump process for manufacturing silicon photonic wafeCertification：ISO 45001（SGS Taiwan Ltd.）Company website：https://www.berich.com.tw/dp/cmpinfo/Cmpinfo.asp?cmpname=%B7%E7%AEp%A5b%BE%C9%C5%E9Phone：03-5971111Main product：Semiconductors

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