E-CMOS CORPORATION
飛虹高科股份有限公司
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1987Founded
NT$409MPaid-in capital
1Plants
3Certifications
3Patents
NT$20–100MRevenue band
- Unified Business No.
- 22764634
- Industry
- Electronic Components (2,523)
- Main products
- Semiconductors (243)
- Location
- NO.1, YANXIN 2ND RD., HSINCHU SCIENCE PARK, HSINCHU CITY, TAIWAN, R.O.C.
Hsinchu City (1,019) · East Dist. (401) - Listing
- Public company (unlisted) (298) 3342
- Organisation type
- Company Limited by Shares
- Founded
- 1987-11-21
- Paid-in capital
- NT$ 409,095,090
- Representative
- Hsiao Fang-cheng
- Phone
- 03-5785888
- Website
- https://www.ecmos.com.tw/
- Exporter
- Yes — registered with the Trade Administration
- Annual revenue band
- NT$20–100M
- Ownership
- Group subsidiary / corporate-held · Yao Fa Tou Tzu Co., Ltd.
- Representative tenure
- In office since at least 2013 (13+ years)
- Growth & profitability
- Revenue 2026-09 YoY +6.3%, year-to-date +2.1%
Gross margin 22.4%, operating margin 5.3%, net margin -3% (2026-Q2 YTD)
Certifications 3
- ISO 14001 (1,159)Self-reported
- ISO 9001 (4,293)Self-reported
- QC 080000 (164)Self-reported
Processes & materials 16
- Rubber & silicone (739) · PolymerSelf-reported
- CNC machining (1,033) · MachiningSelf-reported
- SMT (227) · Assembly & inspectionSelf-reported
- CMM measurement (210) · Assembly & inspectionSelf-reported
- Coating & painting (289) · Surface treatmentSelf-reported
- Injection Molding (497) · FormingSelf-reported
- EDM (216) · MachiningSelf-reported
- Mould design & manufacturing (644) · MachiningSelf-reported
- Grinding (430) · MachiningSelf-reported
- Precision machining (353) · MachiningSelf-reported
- Assembly (901) · Assembly & inspectionSelf-reported
- Surface treatment (576) · Surface treatmentSelf-reported
- Turning (507) · MachiningSelf-reported
- Milling (482) · MachiningSelf-reported
- Laser Engraving (147) · MachiningSelf-reported
- Electroplating (567) · Surface treatmentSelf-reported
Patents 3
- 2026 Control circuit based on power conversion chip
- 2024 Energy conversion chip
- 2021 Step-down integrated circuit
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