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Patent：2026 Semiconductor package with edge-side interconnect and semiconductor package assembly andPatent：2026 Method for forming composite semiconductor wafer and heterogeneous semiconductor structuPatent：2026 Chassis circuit shrink and stretch platform for servo processor and rack server unitCertification：ISO/IEC 27001（Huan'ao International Certification Co., Ltd.）Company website：https://etron.com/zh-hant/aboutus/company/Phone：(03)5782345Main product：Semiconductors

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