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Patent：2026 Semiconductor device and manufacturing method thereofPatent：2026 Semiconductor structure comprising optical device and process method thereofPatent：2026 Package structureCertification：ISO 45001（Li'enwei International Certification Co., Ltd.）Certification：ISO 50001（SGS Taiwan Ltd.）Certification：TOSHMS（Li'enwei International Certification Co., Ltd.）Company website：https://www.tsmc.comPhone：03-5636688Main product：Semiconductors

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