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Patent：2025 Preformed conductive pillar structure combined with circuit and manufacturing method thePatent：2025 Package lead frame with multiple rows of lead pads and manufacturing method thereofPatent：2024 Surface roughening method of metal substrate and manufacturing method of package lead frCertification：ISO 14064Company website：https://www.fushengco.com/zh-tw/msg/fusheng-electronics.htmlPhone：03-5774981#240Main product：Semiconductors

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